Bondmaster 1000E+


BondMaster 1000e+

The BondMaster is a versatile, full-multimode instrument offering pitch-catch, MIA (mechanical impedance analysis), and resonance modes. Allows users to select the best method for a particular application and to test bonds and inspect a wide variety of composite materials.

The BondMaster 1000e+ allows users to select the best method for a particular application and to inspect a wide variety of composite materials. Its high performance, light weight, and rugged durability make it the ideal choice for applications related to the manufacturing, maintenance, and repair of composite materials.

With customer-interchangeable displays, the BondMaster 1000e+ offers users the highest resolution available today. The availability of a color or monochrome LCD for indoor or bright outdoor conditions, or a high-bright electroluminescent display (ELD) for normal to dark conditions provides the ultimate in flexibility and convenience. Its rugged, well-designed housing, uncomplicated front panel, SmartKnob™, and built-in PowerLink™ technology make the BondMaster 1000e+ a truly revolutionary and user-friendly handheld flaw detector.

The BondMaster 1000e+ uses PowerLink technology to automatically configure the instrument when a probe is connected. Built-in calibration modes assist the user in optimizing the test parameters. A variety of probes is available for each of the test technologies.

Features

  • Improved processor speed (up to 10 times faster)
  • Full multimode capability:
    • Pitch-catch (RF, impulse, swept)
    • MIA (mechanical impedance analysis)
    • Resonance
  • Customer-interchangeable displays:
    • High-bright electroluminescent
    • Monochrome liquid crystal
    • Color liquid crystal
  • Improved screen displays:
    • Split-screen displays (P-C RF, P-C impulse)
    • Outdoor display
  • VGA output
  • Field-replaceable Li-ion battery
  • Lightweight, 2 kg (4.4 lb)
  • USB output (via adapter) for printer or computer interface
  • Alarm outputs
  • Program and trace storage
  • PowerLink technology provides automatic probe recognition and instrument setup
  • High-voltage pitch-catch probes are available

BondMaster 1000e+ Specifications

Inspection Methods
When a probe is connected to the BondMaster™ 1000e+, the instrument is automatically configured for the probe type.
The five inspection methods are pitch-catch (RF, impulse, and swept), MIA (mechanical impedance analysis), and resonance.
Pitch-Catch RF: Measures amplitude and phase changes using a short burst of energy to detect disbonds. Displays information in envelope or vector display format. An impedance display is available from the RF data. Requires no couplant.
Pitch-Catch Impulse: Measures amplitude and phase changes using a short burst of energy to detect disbonds. Displays information in envelope or vector display format. Requires no couplant.
Pitch-Catch Swept: Measures amplitude and phase changes using a swept frequency method to detect disbonds. Requires no couplant (5 kHz to 100 kHz).
MIA: Measures the stiffness characteristics of the material under test. The output is measured in both phase and amplitude. Requires no couplant.
Resonance: Detects disbonds by changes in phase and amplitude of probe resonance. Requires couplant.

Inputs and Outputs
Probe Connector: 11-pin Fisher
Analog Outputs: Signals: ±5 V, adjustable offset, not affected by position controls or zoom function.
Technical Specifications
Frequency Range: 250 Hz to 1.5 MHz. Specific test modes may have limitations within this range.
Gain: -10 dB to 50 dB
Analog Output Update: Continuous rate in MIA and resonance mode. Data available at repetition rate for all pitch-catch methods.
Alarm Box: The instrument allows for any size alarm box. The box can be defined and located anywhere on the screen. An adjustable vertical-amplitude alarm operates in the RF and impulse setup mode.
Alarm Logic: Positive or negative alarm gate
Alarm Output: 0 V to 3 V HC logic output, switchable audible alarm, and front panel annunciator. Alarm indicator on probe is standard.
Clock and Calendar: Time and date are stored and printed with each waveform.
Languages: Menus can be displayed in English, Spanish, French, or German.
RS-232/USB Interface: Screen printout and computer interface. USB out is via an RS-232 adapter.
Screen Storage: Up to 20 screens can be stored.
Program Storage: Up to 100 instrument setups can be stored.
General
Dimensions: 9.5″ L x 5.5″ H x 3.6″ D (215 mm x 165 mm x 92 mm)
Weight: 2 kg (4.4 lb)
Display: Customer-interchangeable QVGA displays (320 pixels x 240 pixels): color or monochrome LCD, high-bright electroluminescent
Operating Temperature: −20 °C to 60 °C (−4 °F to 140 °F)
Storage Temperature: −40 °C to 80 °C (−40 °F to 176 °F)
Humidity: 95 % ± 5 %
Classification: Complies with Class 2 specifications from the MIL-PRF-28800F Handbook.
Altitude: Maximum operating and nonoperating altitude is 4,600 m (15,000 ft).
Hazardous Area Operation: Safe operation as defined by Class I, Division 2, Group D, as found in the National Fire Protection Association Code (NFPA 70), Section 500, and tested using MIL-STD-810F, Method 511.4, Procedure 1.
Power
Power: 7-pin connector to charge the internal batteries and operate the instrument from AC power
Power Requirements: 85 V to 240 V, 50 Hz to 60 Hz mains. External holder charges batteries outside the instrument. Charging time is typically 4 h.
Low Battery Protection: Display bar graph indicates approximate operating time.
Battery Operating Time: 6 h to 8 h (nominal, depending on configuration)

Probes and Accessories
All BondMaster™ 1000e+ probes include PowerLink™ functionality. Pitch-catch (S-PC), MIA (S-MP), and resonance (S-PR) probes are available.
BondMaster PC Interface Software: Enables data transfer to PC.

Pitch-Catch Probes

Pitch-Catch mode uses high-frequency sound waves to transmit surface waves into the test part. A separate receiving element, a set distance from the transmitter, picks up the energy transmitted into the material. The sound waves are carried in a plate-wave mode across the test piece between the two probe tips.

Part CodeItem NumberDescription
9317797U8010012S-PC-P11: Spring-loaded tips, 17 mm (0.67 in.) tip spacing, low voltage
9322074U8770334S-PC-P12: Fixed tips, 17 mm (0.67 in.) tip spacing, high voltage
9322076U8770336S-PC-P13: Spring-loaded tips, 17 mm (0.67 in.) tip spacing, high voltage
9323945U8800601S-PC-P14: Spring-loaded tips, 15 mm (0.59 in.) tip spacing, high voltage
9323954U8629399S-PC-P15: Spring-loaded tips, 13mm (0.51 in.) tip spacing, high voltage
9323952U8010062S-PC-P16:Spring-loaded tips, 15 mm (0.59 in.) tip spacing, high voltage
9322184U8010039SPO-5629-PHV: Spring-loaded tips, 13 mm (0.51 in.) tip spacing, high voltage.
9323942U8010054S-PC-DHV: Differential High Voltage, four spring-loaded tips

MIA Probes

The Mechanical Impedance Analysis (MIA) test mode uses a single-tipped dual-element probe. A drive element generates sound waves and a receive element detects the effect of the structure on probe-tip loading.

Part CodeItem NumberDescription
9317806U8010013S-MP-1: Right angle probe, 12.7 mm (0.5 in.) tip diameter.
9317807U8010014S-MP-2: Straight probe, 6.35 mm (0.25 in.) tip diameter.
9317796U8010011S-MP-3: Right angle probe, 12.7 mm (0.5 in.) tip diameter.
9317808U8010015S-MP-4: Right angle probe, 6.35 mm (0.25 in.) tip diameter.
9322075U8770335S-MP-5: Right angle probe, 12.7 mm (0.5 in.) tip diameter.

Resonance Probes

The Resonance mode contact transducer is driven at its resonant frequency and coupled to the

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sample using a low-viscosity couplant. Impedance changes in the sensor are analyzed to detect changes in the test sample.

Part CodeItem NumberDescription
9317809U8010016S-PR-1: 35 kHz (±5 kHz) in a 15.9 mm (0.63 in.) diameter case
9317810U8010017S-PR-2: 65 kHz (±10 kHz) in a 15.9 mm (0.63 in.) diameter case
9317793U8010008S-PR-3: 110 kHz (±10 kHz) in a 15.9 mm (0.63 in.) diameter case
9317794U8010009S-PR-4: 165 kHz (±10 kHz) in a 12.7 mm (0.5 in.) diameter case
9317795U8010010S-PR-5: 250 kHz (±10 kHz) in a 9.5 mm (0.37 in.) diameter case
9317811U8010018S-PR-6: 330 kHz (±10 kHz) in a 9.5 mm (0.37 in.) diameter case

Kits

Part CodeItem NumberDescription
BM-KIT-PC1U8010069BondMaster Probe and Standard Kit for Pitch-Catch Inspections
Contains: NEC-6407 Reference Standard with S-PC-P14 Pitch-Catch Probe and Cable
BM-KIT-PC2U8010070BondMaster Probe and Standard Kit for Pitch-Catch Inspections
Contains: NEC-6407 Reference Standard with S-PC-P14 and SPO-5629PHV Pitch-Catch Probes and Cable
BM-KIT-MIAU8010071BondMaster Probe and Standard Kit for MIA Inspections
Contains: NEC-6407 Reference Standard with S-MP-3 MIA Probe and BMM-H Spring Holder and Cable
BM-KIT-RES-CU8010072BondMaster Probe and Standard Kit for Resonance Inspections
Contains: NEC-6382 Composite Reference Standard with S-PR-4 Resonance Probe, Couplant and Cable
BM-KIT-RES-AU8010073BondMaster Probe and Standard Kit for Resonance Inspections
Contains: NEC-6384 Aluminum Reference Standard with S-PR-4 Resonance Probe, Couplant and Cable
BM-KIT-PMRU8010074BondMaster Probe and Standard Kit for Pitch-Catch, MIA and Resonance Inspections
Contains: NEC-6407 Reference Standard, S-PC-P14 and SPO-5629PHV Pitch-Catch Probes, S-MP-3 MIA Probe with BMM-H Spring Holder, NEC-6382 Composite Reference Standard, NEC-6384 Aluminum Reference Standard, S-PR-4 Resonance Probe, Couplant and Cables
BondMaster Application Guide
English – 2.2 MB